MEMs
Etches faster
More thorough cleaning into tortuous paths
Removes bubbles which slow mass transfer from substrate surface
Omni-Meg technology uses multi-vectored processing components to evenly transfer megasonic energy directly through solid structures of various shapes and thickness to the substrate or fluid interface for optimal effect. The Wide Area Omni-Meg processing system integrates PCT’s revolutionary Omni-Meg™ Technology directly into the processing bar, enabling uniform energy distribution across both the substrate and bar even with numerous fluid jet holes in the bar’s active surface. The energy coverage is uniform even with the bar mounted face up under the substrate. Plus, the Omni-Meg™ Technology facilitates good cross-substrate energy transfer and uniform energy distribution.
Transducer Plate
Wide Area Nozzle
Learn More about PCT’s Omni-Meg on our Technology Page or Contact PCT to learn what Omni-Meg™ Technology can do for you.
Transducer Plate
Wide Area Nozzle
In addition to wafer cleaning, Omni-Meg™ Technology enables you to experience significant benefits in many new application areas:
MEMs
Etches faster
More thorough cleaning into tortuous paths
Removes bubbles which slow mass transfer from substrate surface
CMP
Remove particles faster
More uniform processing
Electroplating
Eliminates concentration polarization
Enhances plating surface uniformity
SOLAR
In-line processing
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